IET Lead Free Wave Solder Machine MS•450
Manufactured by JT Electronic Equipment CO., LTD
* About JT
• Dimensions
• Specification Sheet
Conveyor System: Titanium center support for larger and panelized
PCBs. Flexible titanium fingers secure the PCB more reliably.
Easily replaced if needed, reducing maintenance and down time.
Integrated finger cleaning system with recirculating solvent
reduces PCB contamination.
Automatic Motorized Spray Fluxer: Spray nozzle is
Servo Motor driven with speed and spray control.
Provides consistent and uniform application of flux across
any PCB at any conveyor speed. Automatically switches
on and off when PCB is detected.
Three Convection Preheating Zones Optimum
preheating profile can be easily obtained. Effectively
improves wetting ability. This is a key requirement for larger
boards, larger components and for the higher temperatures
required for lead• free applications.
Inverter with closed loop control system manages the stability
and accuracy of the conveyor speed. Board guides synchronized
with conveyor system ensure boards enter smoothly into wave
solder machine.
Windows XP: Displays and records temperature control curves.
Logs and prints production statistics. Automatically stores
the operation and status of machine. Displays alarms in
main window.
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IR Boost Heat between the last pre•heater and the solder
wave eliminates the loss of heat prior to soldering.
This is a key feature and requirement for the high temperatures
used in lead•free soldering.
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Anti•corrosion 1500 lb. capacity Titanium Alloy Solder Pot
for lead•free solder. Automatic standby laminar and turbulent
waves (within 30mm of each other) provide optimum temperature
stability and reduced dross generation.
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Motorized Solder Pot: Motorized drive system raises and lowers
the solder pot as well as rolls the solder pot in and out for
ease of maintenance.
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